As of 2024/2025, the active version is (Edition 3.0). This edition consolidated amendments and added rigorous testing for fine-pitch terminals used in miniaturized electronics.
Manufacturers, quality engineers, and PCB assemblers use IEC 60352-5 to validate that press-fit technology meets safety and performance benchmarks.
: Updated copper thickness limits for plated-through holes to match current market manufacturing practices. iTeh Standards For official access, you can find the full document on the IEC Webstore or through regional standards bodies like BSI Knowledge environmental aging sequences defined in the standard?
Defines tolerances for test boards, including plated-through hole (PTH) characteristics and updated copper thickness limits to match modern manufacturing. Electrical Measurement methods for contact resistance to ensure long-term electrical stability. Test Schedules Two distinct programs: Qualification (testing individual press-in zones) and Application (testing connections as part of a complete component). IEC 60352-5:2012
In the world of modern electronics, soldering isn't always the best—or most efficient—way to connect components to a circuit board. Solderless have become a cornerstone of high-reliability industries like automotive and telecommunications. To ensure these connections last, engineers turn to the IEC 60352-5 standard .
Defines qualification test schedules, including mechanical (insertion/withdrawal forces) and electrical (contact resistance) assessments. Recent Updates (2020 Edition):
